The common form of blister packaging and its structure and connection with substrate

daily visible blister packaging have medicinal blister packaging, blister packaging cosmetics, actually there are various blister packaging form, the following content is for reference only

a, the common forms of blister packaging,

with an average of 14 kinds of common blister packaging forms:

1) blister sealing directly on the substrate;

(2) substrate in a groove blister;

3. Pressure wear type blister;

(4) blister sealing in the die-cutting on the substrate;

5. Blister inserted into a groove in the substrate;

6 substrate has a hinge opening;

7) substrate has a folding part, products can be made to put or hang onto the shelf;

today can be squeezed, from inside the blister packed commodities without having to open the blister;

pet-name ruby double blister, substrate with die cutting of holes;

attending all plastic without dividing strip packaging substrate;

⑪ double substrate;

⑫ blister dividing packaging;

⑬ plastic hinge knot or double blister without substrate packing;

⑭ chute type reveal a built-in items of blister packaging;

2, the structure of the blister packaging, and with the substrate connections

substrate can be said to constitute the basis of blister packaging, it has a great impact on the appearance and quality of blister packaging. Substrate are many ways to connect with blister is the main way of heat sealing. In addition to the heat sealing, still can use other methods of sealing, such as the groove in the insert substrate blister, still can glue or nails.

main methods for the above said the common form of blister packaging, for example, for example, among them such as '(1) blister sealing directly on the substrate is heated above the plastic sheets, in the form of heat through the wafer to that of the substrate sealing, can also through the substrate is heated from below, with blister sealing; The pet-name ruby attending two forms from both up and down heating, make the substrate and caught in the middle of the plastic chip sealing; The second 'substrate in a groove blister' is in the form of the substrate directly inserted into a groove in the blister, not through heat sealing; 5 kind of form is the blister inserted into a groove in the substrate, this method can use glue or nail links or

the place on put together is narrated, blister sealing method and the substrate could be selected according to the specific situation, should not stick to one pattern.