Solvent-free 121 ℃ transparent cooking compound packaging process control

Cooking products using solvent-free composite manufacturer of composite membrane is relatively few, although many of the test manufacturer can meet the requirements, but the stability of the batch production and the risk remains to be discussed. Cooking temperature to distinguish, the solvent-free cooking process is mainly suitable for 121 ℃ composite bags, cooking 135 ℃ cooking products are rarely used, and this is mainly because no solvent adhesives solvent-free process is not very mature, to further improve and perfect also need adhesives. Even 121 ℃ transparent type of cooking products, if improper control in the process of the operation, also can appear after cooking torn bags, such as hierarchical anomalies. Generally speaking, we can from the material, the temperature and humidity, the gluing quantity, to strengthen the control winding and curing, etc. Due to the smaller one, the material thickness deviation of solvent-free composite glue quantity is very small, only a dry type composite 1/2 ~ 1/3, namely around 2 g / ㎡, and requirements for the thickness deviation of each layer material is very small, especially the inner material RCPP thickness control. In general solvent-free composite cooking products, lining material can be in more than 50 um, and the gluing quantity is only 1. 5 ~ 2. About 5 um thickness. If material thickness deviation is large, can cause the composite semi-finished products after winding, in solvent-free adhesives movement within the roll of film, causing the materials on the position of the thin glue quantity is large, the location of the material thickness on the glue quantity is small. This is because the location of the material compared to the position of the thick thin winding large internal stress, which can cause by material thick glue to flow direction of thin place, causing unqualified product local position cooking effect after curing or stratified phenomenon. Second, the influence of temperature and humidity on the curing process of curing solventless adhesives is actually solvent-free NCO group of main agent and curing agent OH groups under certain temperature and humidity of the reaction process, so the reaction of the solventless adhesives completely degree affected by curing agent ratio of main agent and humidity, and high-temperature cooking products because the gluing quantity larger than ordinary products, the main agent curing agent ratio and humidity effects on curing adhesive is bigger also. Therefore in the actual production, to adjust the corresponding main agent according to different areas in different seasons curing agent ratio. Three, the gluing quantity balance and the winding system is well known, solvent-free composite process of a malpractice is compound semi-finished products after the plane, the glue without early viscous force and liquid, and solvent-free process winding system requirements for equipment is very high. If machine winding system is bad, it will be off the plane after the glue to face out, winding roll phenomenon such as wrinkles. Solvent-free cooking process for finished goods subsequent workability, determines the cooking products on the amount of 25% ~ 40% higher than ordinary products, so compared to common products are more likely to appear outflow glue phenomenon. Besides winding system without solvent, solvent-free resin compound when the longitudinal and transverse uniformity is also very important, if the gluing quantity disequilibrium, while glue will have a certain amount of liquidity to make up for, but I still can't completely avoid finished product when local glue quantity is small, thus influence on the performance of the finished cooking.